About
This archival Journal is a publication of the International Microelectronics And Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.
The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher.
IMAPS members receive complimentary access to the On-line Journal with their membership.
IMAPS Journal of Microelectronics and Electronic Packaging
Editor-in-Chief
Editor-in-Chief
Associate Editors
Liangyu Chen, Ph.D. Senior Scientist Ohio Aerospace Institute/NASA Glenn Research Center Cleveland, OH, USA [email protected] |
Yunhui Joe Mei, Ph.D. Associate Professor Center of High-Temperature Electronic Packaging School of Material Science and Engineering Tianjin University, Tianjin, China [email protected] |
Andrzej Dziedzic, Ph.D., D.Sc. Professor Wroclaw University of Technology Wroclaw, Poland [email protected] |
Jens Müller, Ph.D. Professor and Director Institute for Micro- and Nanotechnologies MacroNano® Ilmenau University of Technology, Ilmenau, Germany [email protected] |
Yu “Gary” Gu, Ph.D. Member of Technical Staff Qorvo, Inc. Greensboro, NC, USA [email protected] |
Ivan Ndip, Ph.D. Head of the Department of RF & Smart Sensor Systems Fraunhofer IZM, Berlin Lecturer, Technical University Berlin, Germany [email protected] |
Kun Fang, Ph.D. Senior IC Packaging Engineer Qualcomm Technologies, Inc. San Diego, CA, USA [email protected] |
Chandradip Patel, Ph.D. CPE Technology Engineer Schlumberger Technology Corporation Sugar Land, TX, USA [email protected] |
Lu Fang, Ph.D. Principal Member of Technical Staff Sandia National Laboratories Albuquerque, NM, USA [email protected] |
Bruce Romenesko, Ph.D. Principal Staff Physicist Applied Physics Laboratory Johns Hopkins University Laurel, MD, USA [email protected] |
Bruce Kim, Ph.D. Professor Electrical Engineering City University of New York New York, NY, USA [email protected] |
Yiliang Wu, Ph.D. Principle Scientist TE Connectivity Menlo Park, CA, USA [email protected] |
Yeong K. Kim, Ph.D. Professor School of Interdisciplinary Studies Inha University Incheon, Korea [email protected] |
Zhi Yang, Ph.D. Chip Package Technologies Sunnyvale, CA, USA [email protected] |
Sangil Lee, Ph.D. Module Packaging Engineer Apple Cupertino, CA, USA [email protected] |
Shuye Zhang, Ph.D. Assistant Professor, Department of Materials Science and Engineering Harbin Institute of Technology Harbin, Heilongjiang, China [email protected] |
Thomas Marinis, Ph.D. Principal Member of Technical Staff Draper Laboratory Cambridge, MA, USA [email protected] |