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This archival Journal is a publication of the International Microelectronics And Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher.

IMAPS members receive complimentary access to the On-line Journal with their membership.

IMAPS Journal of Microelectronics and Electronic Packaging

Jianbiao John Pan, Ph.D., CQE, CRE Professor, Industrial & Manufacturing Engineering California Polytechnic State University San Luis Obispo, CA, USA

Associate Editors

Liangyu Chen, Ph.D.
Senior Scientist
Ohio Aerospace Institute/NASA Glenn Research Center
Cleveland, OH, USA
Yunhui Joe Mei, Ph.D.
Associate Professor
Center of High-Temperature Electronic Packaging
School of Material Science and Engineering
Tianjin University, Tianjin, China
Andrzej Dziedzic, Ph.D., D.Sc.
Wroclaw University of Technology
Wroclaw, Poland
Jens Müller, Ph.D.
Professor and Director
Institute for Micro- and Nanotechnologies MacroNano®
Ilmenau University of Technology, Ilmenau, Germany
Yu “Gary” Gu, Ph.D.
Member of Technical Staff
Qorvo, Inc.
Greensboro, NC, USA
Ivan Ndip, Ph.D.
Head of the Department of RF & Smart Sensor Systems Fraunhofer IZM, Berlin
Lecturer, Technical University Berlin, Germany
Kun Fang, Ph.D.
Senior IC Packaging Engineer
Qualcomm Technologies, Inc.
San Diego, CA, USA
Chandradip Patel, Ph.D.
CPE Technology Engineer
Schlumberger Technology Corporation
Sugar Land, TX, USA
Lu Fang, Ph.D.
Principal Member of Technical Staff
Sandia National Laboratories
Albuquerque, NM, USA
Bruce Romenesko, Ph.D.
Principal Staff Physicist
Applied Physics Laboratory
Johns Hopkins University
Laurel, MD, USA
Bruce Kim, Ph.D.
Electrical Engineering
City University of New York
New York, NY, USA
Yiliang Wu, Ph.D.
Principle Scientist
TE Connectivity
Menlo Park, CA, USA
Yeong K. Kim, Ph.D.
School of Interdisciplinary Studies
Inha University
Incheon, Korea
Zhi Yang, Ph.D.
Chip Package Technologies
Sunnyvale, CA, USA
Sangil Lee, Ph.D.
Module Packaging Engineer
Cupertino, CA, USA
Shuye Zhang, Ph.D.
Assistant Professor, Department of Materials Science and Engineering
Harbin Institute of Technology
Harbin, Heilongjiang, China
Thomas Marinis, Ph.D.
Principal Member of Technical Staff
Draper Laboratory
Cambridge, MA, USA
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