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This archival Journal is a publication of the International Microelectronics And Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher.

IMAPS members receive complimentary access to the On-line Journal with their membership.

IMAPS Journal of Microelectronics and Electronic Packaging

Jianbiao John Pan, Ph.D., CQE, CRE Professor, Industrial & Manufacturing Engineering California Polytechnic State University San Luis Obispo, CA, USA [email protected]

Associate Editors

Liangyu Chen, Ph.D.
Senior Scientist
Ohio Aerospace Institute/NASA Glenn Research Center
Cleveland, OH, USA
[email protected]
Yunhui Joe Mei, Ph.D.
Associate Professor
Center of High-Temperature Electronic Packaging
School of Material Science and Engineering
Tianjin University, Tianjin, China
[email protected]
Andrzej Dziedzic, Ph.D., D.Sc.
Wroclaw University of Technology
Wroclaw, Poland
[email protected]
Jens Müller, Ph.D.
Professor and Director
Institute for Micro- and Nanotechnologies MacroNano®
Ilmenau University of Technology, Ilmenau, Germany
[email protected]
Yu “Gary” Gu, Ph.D.
Member of Technical Staff
Qorvo, Inc.
Greensboro, NC, USA
[email protected]
Ivan Ndip, Ph.D.
Head of the Department of RF & Smart Sensor Systems Fraunhofer IZM, Berlin
Lecturer, Technical University Berlin, Germany
[email protected]
Kun Fang, Ph.D.
Senior IC Packaging Engineer
Qualcomm Technologies, Inc.
San Diego, CA, USA
[email protected]
Chandradip Patel, Ph.D.
CPE Technology Engineer
Schlumberger Technology Corporation
Sugar Land, TX, USA
[email protected]
Lu Fang, Ph.D.
Principal Member of Technical Staff
Sandia National Laboratories
Albuquerque, NM, USA
[email protected]
Bruce Romenesko, Ph.D.
Principal Staff Physicist
Applied Physics Laboratory
Johns Hopkins University
Laurel, MD, USA
[email protected]
Bruce Kim, Ph.D.
Electrical Engineering
City University of New York
New York, NY, USA
[email protected]
Yiliang Wu, Ph.D.
Principle Scientist
TE Connectivity
Menlo Park, CA, USA
[email protected]
Yeong K. Kim, Ph.D.
School of Interdisciplinary Studies
Inha University
Incheon, Korea
[email protected]
Zhi Yang, Ph.D.
Chip Package Technologies
Sunnyvale, CA, USA
[email protected]
Sangil Lee, Ph.D.
Module Packaging Engineer
Cupertino, CA, USA
[email protected]
Shuye Zhang, Ph.D.
Assistant Professor, Department of Materials Science and Engineering
Harbin Institute of Technology
Harbin, Heilongjiang, China
[email protected]
Thomas Marinis, Ph.D.
Principal Member of Technical Staff
Draper Laboratory
Cambridge, MA, USA
[email protected]
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