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K.N. Seetharamu
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Journal Articles

Analysis, Design, and Optimization of Thermal In-Plane Microactuator—Chevron Type

Open Access
K.B. Puneeth, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2011) 8 (3): 102–109.
https://doi.org/10.4071/imaps.0296
Published: 01 July 2011
View articletitled, Analysis, Design, and Optimization of Thermal In-Plane Microactuator—Chevron Type
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Journal Articles

Analysis and Optimization of Flow and Heat Transfer in a Liquid Cooling System for an LED Array

Open Access
Samhitha Poonacha, Basawaraj, Hemanth Kumar T.R. Seetharam, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2011) 8 (2): 72–82.
https://doi.org/10.4071/imaps.295
Published: 01 April 2011
View articletitled, Analysis and Optimization of Flow and Heat Transfer in a Liquid Cooling System for an LED Array
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Journal Articles

Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling

Open Access
Pradeep Hegde, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2010) 7 (2): 90–98.
https://doi.org/10.4071/1551-4897-7.2.90
Published: 01 April 2010
View articletitled, Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling
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Journal Articles

An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic Packaging

Open Access
D. Sujan, M.V.V. Murthy, A.Y. Hassan, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2008) 5 (1): 36–42.
https://doi.org/10.4071/1551-4897-5.1.36
Published: 01 January 2008
View articletitled, An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic Packaging
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Journal Articles

Simulation of Mold Filling for Non-Newtonian Fluids - Part 2

Open Access
Venkatesh M. Kulkarni, Chu Wee Liang, C.W. Tan, P.A. Aswatha Narayana, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2006) 3 (2): 52–60.
https://doi.org/10.4071/1551-4897-3.2.52
Published: 01 April 2006
View articletitled, Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
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Journal Articles

Thermal Design Optimization of Optoelectronic Package

Open Access
N. Aizar A. Karim, P.A. Aswatha Narayana, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (4): 232–239.
https://doi.org/10.4071/1551-4897-2.4.232
Published: 01 October 2005
View articletitled, Thermal Design Optimization of Optoelectronic Package
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Journal Articles

Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package

Open Access
Fu-Mauh Wong, K.N Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (3): 197–207.
https://doi.org/10.4071/1551-4897-2.3.197
Published: 01 July 2005
View articletitled, Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package
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Journal Articles

Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling

Open Access
Pradeep Hegde, K.N. Seetharamu, P.A. Aswatha Narayana, Zulkifly Abdullah
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (2): 122–131.
https://doi.org/10.4071/1551-4897-2.2.122
Published: 01 April 2005
View articletitled, Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling
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Journal Articles

Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2

Open Access
Cheang Soon Yee, G.A. Quadir, Z.A. Zainal, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (2): 98–109.
https://doi.org/10.4071/1551-4897-2.2.98
Published: 01 April 2005
View articletitled, Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2
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Journal Articles

Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1

Open Access
Cheang Soon Yee, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (1): 40–54.
https://doi.org/10.4071/1551-4897-2.1.40
Published: 01 January 2005
View articletitled, Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1
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Journal Articles

A New Method of Determining the Thermal Resistance of Microelectronic Packages

Open Access
King-Long Teoh, K.N. Seetharamu, Ahmad Yusoff Hassan
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2005) 2 (1): 84–97.
https://doi.org/10.4071/1551-4897-2.1.84
Published: 01 January 2005
View articletitled, A New Method of Determining the Thermal Resistance of Microelectronic Packages
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Journal Articles

Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids

Open Access
Chu Wee Liang, Venkatesh M. Kulkarni, P.A.A. Aswataha Narayana, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2004) 1 (4): 200–205.
https://doi.org/10.4071/1551-4897-1.4.200
Published: 01 October 2004
View articletitled, Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids
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Journal Articles

Investigation of Delamination Between Leadframe and Mold Compound on a LED Package

Open Access
Fu-Mauh Wong, K.N Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2004) 1 (4): 269–281.
https://doi.org/10.4071/1551-4897-1.4.269
Published: 01 October 2004
View articletitled, Investigation of Delamination Between Leadframe and Mold Compound on a LED Package
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Journal Articles

Immersion Cooling of Vertically Mounted Plastic Packages Using Various Flourinert Liquids

Open Access
Logendran Bharatham, G. A. Quadir, A. Y. Hassan, K.N. Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2004) 1 (3): 157–168.
https://doi.org/10.4071/1551-4897-1.3.157
Published: 01 July 2004
View articletitled, Immersion Cooling of Vertically Mounted Plastic Packages Using Various Flourinert Liquids
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Journal Articles

Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module

Open Access
Fu Mauh Wong, Chee Keong Chong, K.N Seetharamu
Journal: Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging (2004) 1 (3): 145–156.
https://doi.org/10.4071/1551-4897-1.3.145
Published: 01 July 2004
View articletitled, Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module
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